multilayer ceramic chip capacitors 1 of 3 creation date : april 24, 2017 (gmt) c1608jb1e105m080ac tdk item description c1608jb1e105mt**** applications commercial grade feature general general (up to 50v) series c1608 [eia 0603] status production (not recommended for new design) size length(l) 1.60mm 0.10mm width(w) 0.80mm 0.10mm thickness(t) 0.80mm 0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 1f 20% rated voltage 25vdc temperature characteristic jb(10%) dissipation factor (max.) 5% insulation resistance (min.) 100m other soldering method wave (flow) re?ow aec-q200 no packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : april 24, 2017 (gmt) c1608jb1e105m080ac characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c1608jb1e105m080ac esr c1608jb1e105m080ac capacitance c1608jb1e105m080ac dc bias characteristic c1608jb1e105m080ac temperature characteristic c1608jb1e105m080ac(no bias) c1608jb1e105m080ac(dc bias = 12.5v ) ripple temperature rising c1608jb1e105m080ac(100khz) c1608jb1e105m080ac(500khz) c1608jb1e105m080ac(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : april 24, 2017 (gmt) c1608jb1e105m080ac associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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